On behalf of the 2027 WMED Organizing Committee, we are pleased to announce the First Call for Papers and manuscript submission deadline for the 24td annual IEEE Workshop on Microelectronics and Electron Devices. The workshop will be held in person on March 26, 2027 in the Simplot Ballroom of the Student Union at Boise State University.

Key Dates:

• January 15, 2027 - Manuscript Submission Deadline
• January 25, 2027 - Registration Opens
• February 12, 2027 - Notification of Accepted Papers
• February 26, 2027 - Final Draft of Accepted Papers Submission Deadline
• March 26, 2027 - WMED 2026 Workshop

The workshop provides a great opportunity to interact with professionals and academics involved in all aspects of micro- and nano-electronics. Come share your research, while learning from the work of others. 

IEEE WMED will provide a forum for reviewing and discussing all aspects of micro- and nano-electronics including processing, electrical characterization, artificial intelligence, design, and new device technologies. This virtual workshop will consist of invited and contributed talks, papers, and a poster session available throughout the day. Faculty, students, and researchers in industry are encouraged to contribute papers on either completed research or work in progress.

Topics in the following areas will form the contributing sessions and poster session in the workshop:

• Microelectronic Device Processing and Process Integration - Trends in submicron CMOS technology, product development (DRAM, SRAM, Flash, SoC's and sensors), new device technologies (phase change memory, resistive memory, ferroelectric memory), novel transistors, process technology enabling artificial intelligence systems
• Nanoelectronic Devices and MEMS - Novel processes, materials and device characterization on nanotubes, nanowires, quantum dots, molecular devices, MEMS research 
• Microelectronic Device Electrical and Reliability Testing - Dielectric reliability, device reliability, novel memory technology testing schemes
• Semiconductor Packaging and Reliability - Semiconductor package reliability, design for manufacturability, stacked die packaging and novel assembly processes
• Microelectronic Circuit and System Design - New product design, AI/ML-assisted design, high-speed and low-power design techniques and system architectures and memory sensing schemes
• Microelectronic Circuit Assurance and Security - Emerging hardware security threats and vulnerabilities, security-related topics in microelectronic device design and integration, nanoelectronic devices, MEMS, and packaging
• Emerging Memory - High Bandwidth Memory (Advanced System Architecture, Design, Performance, Integration Challenges, Reliability, and Testing) and In-Memory Computing (Architectures for AI & machine learning, Energy efficiency, performance trade-offs, Emerging applications, and future trends)
• Artificial intelligence Applications in Microelectronic Circuits, Systems, and Devices - AI-Enhanced Hardware Design and Optimization, AI for Hardware Security and Threat Mitigation, AI in Nanoelectronics Devices and MEMS, and AI-Integrated Semiconductor Testing and Reliability

Submitted manuscripts must follow the IEEE publication format guidelines. A template containing manuscript preparation instructions can be downloaded here (select conferences).

Papers can be submitted via the secure online portal: coming soon! 

Please contact the Publication Chair, Mandar Bhoir (mbhoir@micron.com), or General Chair, Amit Ohri (aohri@micron.com), with further questions.