The Twenty-First Annual IEEE Workshop on Microelectronics and Electron Devices (WMED) will provide a forum for reviewing and discussing all aspects of micro- and nano-electronics, including processing, electrical characterization, design, and new device technologies. This workshop will consist of invited and contributed talks, papers, and a daily poster session. Faculty, students, and researchers in industry are encouraged to contribute papers on either completed research or work in progress.
Topics in the following areas will form the contributing sessions and poster sessions in the workshop:
Trends in submicron CMOS technology, product development (DRAM, SRAM, Flash, CMOS Imagers), new device technologies (phase change memory, resistive memory, ferroelectric memory), and novel transistors.
Novel processes, materials and device characterization on nanotubes, nanowires, quantum dots, molecular devices, MEMS research.
Dielectric reliability, device reliability, novel memory technology testing schemes.
Semiconductor package reliability, design for manufacturability, stacked die packaging, and novel assembly processes.
New product design, high-speed and low-power design techniques and system architectures and memory sensing schemes.
An IEEE Publication of the accepted papers and a USB Flash drive, including the papers and presentations, are planned and will be available at the start of the workshop. Submitted manuscripts must follow the IEEE publication format guidelines. A template containing manuscript preparation instructions can be downloaded here.
Please submit your IEEE-formatted manuscript (up to 4 pages) by January 15, 2024, using Easy Chair. For any queries regarding submission, please reach out to the WMED 2024 Publications Chair, Nidish Vashistha (nidishvashis[AT]micron[dot]com. The Technical Program Committee will have a peer-review process to meet the IEEE criterion for minimum publication quality standards. Inquiries can be directed to Curtis Cahoon (IEEE WMED 2024 General Chair, xx[AT]hotmail[dot]com).
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