WMED 2025 Call For registration is closed!

2023 IEEE Workshop on Microelectronics & Electron Devices
2023 IEEE Workshop on Microelectronics & Electron Devices
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Call for Papers- Open for 2025

On behalf of the 2025 WMED Organizing Committee, we are pleased to announce the Second Call for Papers and manuscript submission deadline for the 22nd annual IEEE Workshop on Microelectronics and Electron Devices. Please note that the paper Submission deadline has been extended to January 31st, 2025. The Workshop will be held in person on March 28th, 2025  at the Stueckle Sky Center at Boise State University. It provides a great opportunity to interact with professionals and academics involved in all aspects of micro- and nano-electronics. Come share your research, while learning from the work of others. 


IEEE WMED will provide a forum for reviewing and discussing all aspects of micro- and nano-electronics including processing, electrical characterization, artificial intelligence, design and new device technologies. This virtual workshop will consist of invited and contributed talks, papers and a poster session available throughout the day. Faculty, students and researchers in the industry are encouraged to contribute papers on either completed research or work in progress

Topics in the following areas will form the contributing sessions and poster sessions in the workshop:

Microelectronic Device Processing and Process Integration

Trends in submicron CMOS technology, product development (DRAM, SRAM, Flash, CMOS Imagers), new device technologies (phase change memory, resistive memory, ferroelectric memory), novel transistors, process technology enabling artificial intelligence systems

Nanoelectronic Devices and MEMS

Novel processes, materials and device characterization on nanotubes, nanowires, quantum dots, molecular devices, MEMS research 

Microelectronic Device Electrical and Reliability Testing

Dielectric reliability, device reliability, novel memory technology testing schemes

Semiconductor Packaging and Reliability

Semiconductor package reliability, design for manufacturability, stacked die packaging and novel assembly processes

Microelectronic Circuit and System Design

New product design, AI/ML-assisted design, high-speed and low-power design techniques and system architectures and memory sensing schemes

Microelectronic Circuit Assurance and Security

Emerging hardware security threats and vulnerabilities, security-related topics in microelectronic device design and integration, nanoelectronic devices, MEMS, and packaging

Emerging Memory

High Bandwidth Memory (Advanced System Architecture, Design, Performance, Integration Challenges, Reliability, and Testing) and In-Memory Computing (Architectures for AI & machine learning, Energy efficiency, performance trade-offs, Emerging applications, and future trends)

Artificial intelligence Applications in Microelectronic Circuits, Systems, and Devices

AI-Enhanced Hardware Design and Optimization, AI for Hardware Security and Threat Mitigation, AI in Nanoelectronics Devices and MEMS, and AI-Integrated Semiconductor Testing and Reliability

Submitted manuscripts must follow the IEEE publication format guidelines. A template containing manuscript preparation instructions can be downloaded here. Please submit your IEEE-formatted manuscript (up to 4 pages) here: easychair


Our workshop is dependent on the generous support of our sponsors. Please visit here to learn more about opportunities to sponsor the 22nd Annual IEEE Workshop on Microelectronics and Electron Devices and about our 2024 sponsors


In addition, here is the information related to a short course that is being offered by Boise State on March 27th in conjunction with WMED for engineering students.


Please feel free to pass this information on to all those who may be interested in participating in WMED. The key dates for the workshop are listed below:

  • January 31st, 2025  - Manuscript Submission Deadline
  • February 28th, 2025 - Recommended submission for poster abstract (if IEEE publication is desired)
  • March 21st, 2025 - Advance Registration Deadline
  • March 28th, 2025 - WMED 2025 Workshop


If you have any questions about submission, please contact the WMED 2025 Publications Chair, John Chaka(john.chaka@siemens.com). The Technical Program Committee will have a peer-review process to meet the IEEE criterion for minimum publication quality standards. Inquiries can be directed to Sandeep Chalamalasetty (IEEE WMED 202 General Chair, sivanagasundeep@gmail.com).

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